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 MBRS2040LT3 Surface Mount Schottky Power Rectifier
SMB Power Surface Mount Package
. . . employing the Schottky Barrier principle in a metal-to-silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes.
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* * * * * * * * * * * * *
Compact Package with J-Bend Leads Ideal for Automated Handling Highly Stable Oxide Passivated Junction Guardring for Over-Voltage Protection Low Forward Voltage Drop Pb-Free Package May be Available. The G-Suffix Denotes a Pb-Free Lead Finish Case: Molded Epoxy Epoxy Meets UL94, VO at 1/8 Weight: 95 mg (approximately) Maximum Temperature of 260C / 10 Seconds for Soldering Cathode Polarity Band Available in 12 mm Tape, 2500 Units per 13 inch Reel, Add "T3" Suffix to Part Number Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Marking: BKJL
SCHOTTKY BARRIER RECTIFIER 2.0 AMPERES 40 VOLTS
Mechanical Characteristics:
SMB CASE 403A PLASTIC
MARKING DIAGRAM
BKJL BKJL = Device Code
MAXIMUM RATINGS
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TC = 103C) Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 kHz, TC = 104C) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Storage/Operating Case Temperature Operating Junction Temperature Voltage Rate of Change (Rated VR, TJ = 25C) Symbol VRRM VRWM VR IO IFRM Value 40 Unit V
ORDERING INFORMATION
Device Package SMB SMB (Pb-Free) Shipping 2500/Tape & Reel 2500/Tape & Reel
2.0 4.0
A MBRS2040LT3 A MBRS2040LT3G
IFSM
70
A
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Tstg, TC TJ dv/dt
-55 to +150 -55 to +125 10,000
C C V/ms
(c) Semiconductor Components Industries, LLC, 2003
1
December, 2003 - Rev. 3
Publication Order Number: MBRS2040LT3/D
MBRS2040LT3
THERMAL CHARACTERISTICS Characteristic
Thermal Resistance -- Junction-to-Lead (Note 1.) Thermal Resistance -- Junction-to-Ambient (Note 2.)
Symbol
RJL RJA
Value
22.5 78
Unit
C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 3 ) 3.) see Figure 2 Maximum Instantaneous Reverse Current (Note 3 ) 3.) (VR = 40 V) (VR = 20 V) 1. Minimum pad size (0.108 X 0.085 inch) for each lead on FR4 board. 2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board. 3. Pulse Test: Pulse Width 250 s, Duty Cycle 2.0%. see Figure 4 (IF = 2.0 A) (IF = 4.0 A) IR VF TJ = 25C 0.43 0.50 TJ = 25C 0.8 0.1 TJ = 125C 0.34 0.45 TJ = 100C 20 6.0 mA Volts
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2
MBRS2040LT3
i F, INSTANTANEOUS FORWARD CURRENT (AMPS) 100 IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 100 100
10
10
1.0
TJ = 100C TJ = 125C
TJ = 125C 1.0 TJ = 100C
TJ = 25C
TJ = 25C
TJ = -40C 0.1 0 0.2 0.4 0.6 0.8 vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
0.1 0 0.2 0.4 0.6 0.8 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
100E-3 I R, REVERSE CURRENT (AMPS) 10E-3 TJ = 125C TJ = 100C
100E-3 I R, MAXIMUM REVERSE CURRENT (AMPS) TJ = 125C 10E-3 TJ = 100C 1.0E-3
1.0E-3
100E-6 TJ = 25C
100E-6
TJ = 25C
10E-6
10E-6 1.0E-6
1.0E-6
0
10
20
30
40
0
10
20
30
40
VR, REVERSE VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
I O , AVERAGE FORWARD CURRENT (AMPS)
dc
PFO , AVERAGE POWER DISSIPATION (WATTS)
3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 20
1.2 SQUARE WAVE 1.0 0.8 0.6 0.4 0.2 0 0 0.5 1.0 1.5 2.0 2.5 3.0 IO, AVERAGE FORWARD CURRENT (AMPS) Ipk/Io = p Ipk/Io = 5 Ipk/Io = 10 Ipk/Io = 20 dc
SQUARE WAVE Ipk/Io = p Ipk/Io = 5 Ipk/Io = 10 Ipk/Io = 20
40
60
80
100
120
140
TL, LEAD TEMPERATURE (C)
Figure 5. Current Derating
Figure 6. Forward Power Dissipation
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3
MBRS2040LT3
TJ , DERATED OPERATING TEMPERATURE ( C) 1000 125 Rtja = 22.5C/W 115 105 95 42C/W 85 75 92C/W 65 0 5.0 10 15 20 25 30 35 40 61C/W 78C/W
C, CAPACITANCE (pF)
TJ = 25C
100
10 0 5.0 10 15 20 25 30 35 40 VR, REVERSE VOLTAGE (VOLTS)
VR, DC REVERSE VOLTAGE (VOLTS)
Figure 7. Capacitance
Figure 8. Typical Operating Temperature Derating*
R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED)
* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any reverse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating TJ may be calculated from the equation: TJ = TJmax - r(t)(Pf + Pr) where r(t) = thermal impedance under given conditions, Pf = forward power dissipation, and Pr = reverse power dissipation This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as TJ = TJmax - r(t)Pr, where r(t) = Rthja. For other power applications further calculations must be performed. 1.0 50% 20% 0.1 10% 5.0% 2.0% 0.01 1.0% Rtjl(t) = Rtjl*r(t) 0.001 0.00001
0.0001
0.001
0.01 T, TIME (s)
0.1
1.0
10
100
R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED)
Figure 9. Thermal Response Junction to Lead
1.0 50% 0.1 20% 10% 5.0% 2.0% 0.01 1.0% Rtjl(t) = Rtjl*r(t) 0.001 0.00001
0.0001
0.001
0.01
0.1 T, TIME (s)
1.0
10
100
1,000
Figure 10. Thermal Response Junction to Ambient http://onsemi.com
4
MBRS2040LT3
PACKAGE DIMENSIONS
SMB PLASTIC PACKAGE CASE 403A-03 ISSUE D
S A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
D
B
C
INCHES DIM MIN MAX A 0.160 0.180 B 0.130 0.150 C 0.075 0.095 D 0.077 0.083 H 0.0020 0.0060 J 0.006 0.012 K 0.030 0.050 P 0.020 REF S 0.205 0.220
MILLIMETERS MIN MAX 4.06 4.57 3.30 3.81 1.90 2.41 1.96 2.11 0.051 0.152 0.15 0.30 0.76 1.27 0.51 REF 5.21 5.59
K
P
J
H
SOLDERING FOOTPRINT*
2.261 0.089
2.743 0.108
2.159 0.085
SCALE 8:1 mm inches
SMB
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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5
MBRS2040LT3
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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6
MBRS2040LT3/D


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